Skip to main content

FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Funding Agency
National Institute of Standards and Technology
Funding Type
Faculty
Industry and Innovation
Deadline
Friday, April 12, 2024

This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. The NAPMP program seeks to achieve the following objectivies:

  1. accelerate domestic R&D and innovation in advanced packaging materials and substrates
  2. translate domestic material and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
  3. support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing ; and
  4. promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.

Concept paper due: April 12, 2024

Invited applications due July 3, 2024